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Title Aspact Oy - Home
Description ASPACT is the solution for integration of electronics and mechanics. ASPACT Oy develops novel methods to form high quality copper conductors on plasics or other materials.
Keywords MID, moulded interconnection device, IML, in-mould labelling, 3D electronics, 2.5D electronics, pattern plating, additive deposition, fine line, very fine line

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Additional terms фызфсеюаш, цццюфызфсеюаш, фызфсе,qspqct:fi, zzz:qspqct:fi, qspqct,שדפשבאץכן, '''ץשדפשבאץכן, שדפשבא,شسحشؤفزبه, صصصزشسحشؤفزبه, شسحشؤف